4月24日，据《日经亚洲评论》报道，一篇业内分析文章表示，华为在芯片领域的成就已经媲美苹果，达到世界领先水平。
目前华为芯片全部来自其于2004年成立的海思半导体，包括大家耳熟能详的麒麟系列芯片。不过目前关于海思半导体尚未有任何公开信息与数据可查，华为的芯片研发能力也一直是一个谜。
不过据东京拆机专家网站TechanaLye分析，华为和苹果都设计出拥有同样先进功能的芯片。二者都是7nm线宽。线宽越窄，芯片的计算能力和节能能力就越强。
TechanaLye表示，截至2018年底，只有三种7nm芯片投入实际使用。日本芯片制造商瑞萨电子前高级技术主管、TechanaLye公司CEO Hiroharu Shimizu表示：“华为的研发能力逼近苹果，甚至超越苹果，占据着世界顶级水平。”
目前华为最新的麒麟980处理器与苹果的A12处理器均采用了台积电的7nm工艺，这也是市面上少数采用7nm工艺的厂商之一。另外此前据外媒报道，华为今年下半年将推出采用7nm+EUV（极紫外光刻工艺）工艺的麒麟985芯片。
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